The LDS technology

The conductor path structure on the plastic component is here realized by means of laser structuring and a subsequent chemical metallization.


A metal-organic complex is added to the laser-activable soft plastic. In order to activate this, the laser beam induces a physical-chemical reaction at its focal point. The polymer matrix’s complex bonds are broken up and the metal atoms separated from the ligands. These serve as the seeds, as it were, for the reductive chemical copper-plating

The activation aside, the laser also has to create a micro-rough surface. The fillers inserted in the plastic are not ablated by the laser, only the polymer matrix is.



The production sequence:

1 2 3 4




• Plastic component injection molding


• Structuring and cleaning the “map” of conductor paths


• Chemical metallization (e.g. Cu – Ni -Ag)


• 3D - SMD assembly




Performance characteristics:


Representable degree of complexity: High tl_files/layout/img/ok-button.png
Design variance: 3 D tl_files/layout/img/ok-button.png
Conductor path structure width: 0,15 mm tl_files/layout/img/ok-button.png
Distance btw. conductor paths: 0,15 mm tl_files/layout/img/ok-button.png
Change flexibility: High tl_files/layout/img/ok-button.png
Variant suitability: Very good tl_files/layout/img/ok-button.png
Market acceptance: Very good tl_files/layout/img/ok-button.png
Available polymer basis: Versatile tl_files/layout/img/ok-button.png