The LDS technology
The conductor path structure on the plastic component is here realized by means of laser structuring and a subsequent chemical metallization.
A metal-organic complex is added to the laser-activable soft plastic. In order to activate this, the laser beam induces a physical-chemical reaction at its focal point. The polymer matrix’s complex bonds are broken up and the metal atoms separated from the ligands. These serve as the seeds, as it were, for the reductive chemical copper-plating
The activation aside, the laser also has to create a micro-rough surface. The fillers inserted in the plastic are not ablated by the laser, only the polymer matrix is.
The production sequence:
|Representable degree of complexity:||High|
|Design variance:||3 D|
|Conductor path structure width:||0,15 mm|
|Distance btw. conductor paths:||0,15 mm|
|Variant suitability:||Very good|
|Market acceptance:||Very good|
|Available polymer basis:||Versatile|